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Openings for Application Packaging Engineers at HP,Bangalore(Contract to hire)
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TOPIC: Openings for Application Packaging Engineers at HP,Bangalore(Contract to hire)

Openings for Application Packaging Engineers at HP,Bangalore(Contract to hire) 2 years, 3 months ago #1583

FROM : This e-mail address is being protected from spambots. You need JavaScript enabled to view it

Hi

We are pleased to inform you that currently we have openings for Application packaging Engineers at HP,Bangalore (Contract to hire)

Please find the details:

Yrs of Exp: 3+

Job Description

Skills required.
4 years of Experience in the Application Programming, Maintenance
Atleast 1+ year of experience in Application Packaging
Worked on complete life cycle of Application packaging
Experience in packaging of 32bit and/or 64bit environment (Windows XP and/or Vista)
Candidates must have worked on the one or more of the following tools - Wise Package studio/Install Shield Admin studio, Vista packaging, Radia packaging


If you are interested kindly revert me back with your updated cv and do refer any of your friends or collegues.

Thanks & Regards

Pallavi Nambeti

PRIMUS Global Technologies, Pvt Ltd. | Locations: Dallas | Singapore | Bangalore | Hyderabad |
Ph BLR: +91-80-4174-3151 Ext. 235 |
Email: This e-mail address is being protected from spambots. You need JavaScript enabled to view it | Web Site: www.primusglobal.com |
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