Openings for Application Packaging Engineers at HP,Bangalore(Contract to hire)

created the topic: Openings for Application Packaging Engineers at HP,Bangalore(Contract to hire)
FROM : pallavi@primusglobal.com

Hi

We are pleased to inform you that currently we have openings for Application packaging Engineers at HP,Bangalore (Contract to hire)

Please find the details:

Yrs of Exp: 3+

Job Description

Skills required.
4 years of Experience in the Application Programming, Maintenance
Atleast 1+ year of experience in Application Packaging
Worked on complete life cycle of Application packaging
Experience in packaging of 32bit and/or 64bit environment (Windows XP and/or Vista)
Candidates must have worked on the one or more of the following tools – Wise Package studio/Install Shield Admin studio, Vista packaging, Radia packaging

If you are interested kindly revert me back with your updated cv and do refer any of your friends or collegues.

Thanks & Regards

Pallavi Nambeti

PRIMUS Global Technologies, Pvt Ltd. | Locations: Dallas | Singapore | Bangalore | Hyderabad |
Ph BLR: +91-80-4174-3151 Ext. 235 |
Email: pallavi@primusglobal.com | Web Site: www.primusglobal.com |

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